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NTB6411AN, NTP6411AN,
NVB6411AN
N-Channel Power MOSFET
100 V, 77 A, 14 m W
Features
? Low R DS(on)
? High Current Capability
? 100% Avalanche Tested
? NVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
Qualified and PPAP Capable
? These Devices are Pb ? Free and are RoHS Compliant
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
V (BR)DSS
100 V
http://onsemi.com
R DS(ON) MAX
14 m W @ 10 V
N ? Channel
D
I D MAX
(Note 1)
77 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
100
Unit
V
Gate ? to ? Source Voltage ? Continuous
V GS
$ 20
V
G
Continuous Drain
Current R q JC
Steady
State
T C = 25 ° C
T C = 100 ° C
I D
77
54
A
S
Power Dissipation
R q JC
Pulsed Drain Current
Steady T C = 25 ° C
State
t p = 10 m s
P D
I DM
217
285
W
A
4
4
Operating Junction and Storage Temperature
Range
Source Current (Body Diode)
T J , T stg
I S
? 55 to
+175
77
° C
A
TO ? 220AB
1
2
3
D 2 PAK
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 50 Vdc, V GS = 10 Vdc, I L(pk) =
56 A, L = 0.3 mH, R G = 25 W )
E AS
470
mJ
1
2
3
CASE 221A
STYLE 5
CASE 418B
STYLE 2
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
THERMAL RESISTANCE RATINGS
Parameter
Junction ? to ? Case (Drain) Steady State
T L
Symbol
R q JC
260
Max
0.69
° C
Unit
° C/W
4
Drain
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
Junction ? to ? Ambient (Note 1) R q JA 33
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
1
Gate
NTP
6411ANG
AYWW
3
Source
1
Gate
NTB
6411ANG
AYWW
2
Drain
3
Source
2
Drain
6411AN = Specific Device Code
G = Pb ? Free Device
A = Assembly Location
Y = Year
WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 2
1
Publication Order Number:
NTB6411AN/D
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